Single-Wafer Processing Tool

The company offers a single-wafer processing tool designed to overcome the throughput constraints that have long plagued production yields of chipmakers worldwide.

The success of the system, which has been dubbed the semiconductor industry's first single-wafer, high-yield, high-throughput solution, is based largely on the company's advanced proprietary spin-process technology, which allows customers to record exceptional reliability and throughput, and enables excellent production yield.

The versatility of the 4200 is demonstrated by the number of available options, including process temperatures of up to 85°C, minienvironments, DI-ozone processing, SMIF load ports, endpoint detection systems, buffering systems, and a choice of pin or pinless chucks. These options, combined with specifically developed chemical formulas, allow the spin-processor 4200 to perform wafer operations applicable in both front-end and back-end fab semiconductor processes.

The system offers a cost-effective throughput/footprint and investment/throughput ratio in a variety of process applications including polymer removal, diluted HF etching, highly selective oxide removal and non-selective oxide nitride removal. It has demonstrated uniformity of up to ± 1% (3 sigma), high selectivity and particle contamination of less than 30 particles grater than or equal to 0.16 micrometer in diameter, with heavy metal/ionic contamination measured at less than 1E10 atoms/cm². Quick installation, small footprint, low chemical and DI water consumption and disposal costs are also benefits of the 4200.

SEZ America, Inc., 4824 S. 40th St., Phoenix, AZ 85040. Tel: 602-437-5050. Fax: 602-437-4949.