Single-Wafer Processing Tool
Source: SEZ America, Inc.
This single-wafer processing tool is designed to overcome the throughput constraints that have long plagued production yields for chipmakers
This single-wafer processing tool is designed to overcome the throughput constraints that have long plagued production yields for chipmakers. This system is based on the advanced proprietary spin-process technology.
This system features process temperatures of up to 85°C, minienvironments, DI-ozone processing, SMIF load ports, endpoint detection systems, buffering systems, and a choice of pin or pinless chucks. These options, combined with specifically developed chemical formulas, allow the spin-processor to perform wafer operations applicable in both front-end and back-end fab semiconductor processes.
SEZ America Inc., 4824 S. 40th Street, Phoenix, AZ 85040. Tel: 602-437-5050. Fax: 602-437-4949.