Datasheet | August 1, 2013

Silicon to Glass Bonding Wafer Substrate: SD-2 Datasheet

Source: HOYA Corporation USA Optics Division

HOYA’s SD-2 glass substrate minimizes the distortion and bowing effects caused by a thermal mismatch between two wafers. This is ideal for applications involving semiconductors, pressure sensors, displacement sensors, and photolithography. For a detailed description, information on features, specifications and more, download the datasheet.

access the Datasheet!

Get unlimited access to:
Trend and Thought Leadership Articles
Case Studies & White Papers
Extensive Product Database
Members-Only Premium Content
Welcome Back! Please Log In to Continue. X

Enter your credentials below to log in. Not yet a member of Semiconductor Online? Subscribe today.

Subscribe to Semiconductor Online X

Please enter your email address and create a password to access the full content, Or log in to your account to continue.

or

Subscribe to Semiconductor Online

Please tell us more about you so that we can customize our newsletters to your specific interests: