Silecs Receives New Patent For Chemistries Used In Semiconductor Manufacturing

Mountain View, CA -- Silecs, Inc., a manufacturer of dielectric materials for the semiconductor and flat panel display industries, announced that it has received a new US patent, US 6,974,970, the latest in a series of patents that cover new chemistries for semiconductor and optoelectronic applications. This new patent covers chemical compositions for several silicon based materials used mainly as interlevel dielectrics in integrated circuit (IC) manufacturing, typically in applications requiring high aspect ratio gap-fill and planarization combined with thermo-mechanical robustness and optimized electrical performance.

The patent adds to Silecs' intellectual property portfolio that covers more than 30 issued and pending patents. These patents cover primarily chemical compositional matter on unique silicon chemistries, including a broad range of proprietary precursor molecules and polymer materials, and the use of these materials in semiconductor and optoelectronic processes and devices.

"We are pleased to see our patent coverage strengthened by this newly issued patent," said Dr. Juha Rantala, Chief Technology Officer of Silecs. "We are taking a unique molecular engineering approach to developing new products that match our customers' process requirements and help resolve IC manufacturing roadblocks. This fundamental development approach also yields strong patent coverage for our products."

SOURCE: Silecs, Inc.