Sidense 1T-OTP NVM Qualified In Second-Generation TSMC 180nm BCD Process

Sidense Corp., a leading developer of non-volatile memory OTP IP cores, recently announced that the Company's 1T-OTP macros for TSMC's 180nm BCD 1.8/5.0V Gen 2 process have met all TSMC9000 Assessment program requirements. Sidense OTP macros, at this process node, support applications such as automotive and industrial electronics that require reliable operation and long-life data retention in high-temperature environments. Customers are using Sidense Automotive Grade OTP in a wide range of devices, including power-management ICs, sensors and microcontrollers for applications in automotive, industrial, mobile and consumer devices and systems.

"In April of 2013, we announced meeting TSMC9000 requirements for TSMC 180nm BCD Gen 1," said Tom Schild, Sidense VP of Sales and Marketing. "Providing support for both Gen 1 and Gen 2 reflects Sidense's commitment to its customers, TSMC and the ever-growing requirement for the BCD process."

Sidense Automotive Grade 1T-OTP macros completed full qualification for High-Temperature Operating Life (HTOL) at -40ºC to 150°C and Data Retention Storage Life (DRSL) to 2000 hours at 150°C. This level of qualification was completed to support customers requiring devices to conform to AEC-Q100 Grade 0 specifications and provide data retention over the full operating temperature range, at full duty cycle, for more than 10 years.

Macros are available in a comprehensive range of off-the-shelf configurations supporting small densities of 256 bits for configuration and trim applications, up to 256K bits per macro for code storage and multiple NVM uses. Automotive Grade 1T-OTP provides many advantages, including small footprints to minimize cost, field-programmability, configurations with word widths up to 128 bits and fast read access to allow executing code from OTP for many applications.