News | October 22, 2008

Si2 Announces Sponsorship Of 3-D Architectures For Semiconductor Integration And Packaging Conference

AUSTIN, Texas--(BUSINESS WIRE)--Silicon Integration Initiative (Si2) announced today its sponsorship of the 3-D Architectures for Semiconductor Integration and Packaging Conference. This conference will be held November 17-19, 2008, at the Hyatt Regency San Francisco Airport in Burlingame, CA, and is developed by RTI International.

"Si2's member companies recognize the growing business need for designing and integrating circuits in 3-D, as well as the technical challenges that must be solved," says Steve Schulz, president and CEO of Si2. "One important aspect of 3-D architecture known as System-in-Package is now moving into the industry standardization phase under the leadership of Si2's Design Technology Council. This presents new opportunities that will benefit the entire semiconductor industry."

The reality of 3-D integration and packaging is settling in across the semiconductor industry. Just a few years ago the topic of 3-D was only occasionally mentioned in industry publications or gatherings. Now the topic of 3-D seems to be pervasive, seemingly covered everywhere, all the time. The various performance, size, and cost drivers to the move toward 3-D are well known. Likewise, the various routes and options for implementation of 3-D, whether it be through front-end device manufacturing or in back-end packaging, are often discussed. Near-term market opportunities are widely recognized as well. Regardless of this expanding reality, the situation continues to be very dynamic as technology continues to evolve, and the understanding of cost/performance benefits relative to specific market applications continues to expand. The best path forward, whether from a technology or market standpoint, often remains uncertain.

Senior-level technologists and business leaders have been participating at 3-D Architectures for Semiconductor Integration and Packaging since 2004. This conference series has helped define this emerging arena. With presentations and participants from leading companies and organizations around the world, this conference is aimed at providing information critical to planning ongoing and future business and technical efforts impacted by 3-D integration and packaging. Topics for this year's event include:

  • Market Analysis and Forecasts
  • Commercialization of 3-D Systems
  • Technology Options and Process Flows
  • Thermal Considerations
  • Thru-Silicon-Vias for FPGAs
  • 3-D IC Design Tools and Challenges
  • Efforts from Leading EU Research Institutes

Registration and additional information is available at:

About Si2

Si2 is an organization of industry-leading semiconductor, systems, EDA and manufacturing companies focused on improving the way integrated circuits are designed and manufactured in order to speed time-to-market, reduce costs, and meet the challenges of sub-micron design. Si2 is uniquely positioned to enable collaboration through a strong implementation focus driven by its member companies. Si2 focuses on developing practical technology solutions to industry challenges. Si2 represents nearly 100 companies involved in all parts of the silicon supply chain throughout the world.

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