Shallow Trench Isolation Etch System
Source: Applied Materials, Inc.
The DPS STI Centura system is for etching shallow trench isolation structures in advanced logic and memory devices
The DPS STI Centura system is for etching shallow trench isolation structures in advanced logic and memory devices.
The product features an in situ process that eliminates the need for frequent dry cleaning of the process chamber. It meets requirements for top and bottom corner rounding, as well as profile angle and critical dimension control. Profiles from 70° to grater than 87° are achievable with minimal profile microloading, providing etch depth uniformity of less than three percent.
Applied Materials, Inc., 9700 E. Highway 290, Austin, TX 78724. Tel: 512-272-8436
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