SensArray Introduces Integral Wafer For Plasma, Wet And Planarization Processes
As device manufacturers march toward production implementation of the 65nm process node, their process tools require better process control and metrology. While wireless, wafer-based metrology has provided successful relief for some process applications, many aggressive process steps such as high powered dielectric etch or Chemical Mechanical Polishing (CMP) are still lacking cost effective, production compatible solutions.
Dr. Mei Sun, SensArray's vice president of Sensor Engineering, explains that "previous wafer-based metrology systems had application-specific limitations due to their inherent design; the sensors and data analysis unit in the wafer were protected with encapsulant materials protruding over the wafer surface, causing uneven profile. Our breakthrough architecture removes this limitation by embedding an ultra thin sensor network and power supply within the silicon wafer substrate in such a way that then a thin protective cover can be laminated to the substrate wafer, forming a planar outer wafer surface on both sides."
Integral Wafer is an innovative progression from SensArray's award winning Integrated Wafer wireless platform. Constructed as a laminated wafer, the ultra thin, RF shielded electronics, sensors and battery cells are recessed into a silicon substrate and capped with a protective cover.
This configurable, customer selectable top layer, or cover, constructed of semiconductor grade quality materials shields the embedded network from the processing environment and eliminates the possibility of contamination while enabling insitu process measurements for many applications previously unmeasurable.
The "zero height profile" architecture eliminates any prior equip fit issues and provides a flat measuring surface. Product engineers, conducting state-of-the-art process applications such as CMP or immersion lithography now have access to process measurement insight.
Integral Wafer is compatible with existing OEM plasma etch equipment and is currently available for plasma etch applications -- including high power dielectric etch. Additional applications under field testing include Chemical Mechanical Polishing, wet chemical etch/clean, spin rinse, implant, and immersion lithography.
Available in both 200mm and 300mm wafer sizes, Integral Wafer utilizes SensArray's existing Thermal Map software application for data display and analysis and the BaseStation and CarrierStation for production deployment and storage. A 300mm Integral Wafer includes 65 sensors to measure temperature in a rich spatial format and is capable of high accuracy measurements across a wide operating range of 20 degrees C to 130 degrees C.
SOURCE: SensArray Corporation