SensArray Improves Thermal Measurement Wth Process Probe 1535 Introduction Measures To Greater Accuracy In High Temperature Hot Wall Applications
"Our Process Probe 1535, combining Type R thermocouple materials with our unique ThermaBondTM technology, is an example of SensArray's commitment to develop products specific to our customers needs," said Wayne Renken, president and CEO, SensArray. "Increased accuracy measurements help customers tighten control parameters in oxidizing gas environments and better analyze results to optimize fabrication processes."
With up to 34 measurement points on each wafer, the Process Probe 1535 measures real-time, in-situ temperatures ranging from 0oC to 1,100oC. SensArray's ThermaBond technology features an enhanced thermal conduction bond that helps improve measurement accuracy to ±1.5oC or ±0.25% of reading. Multipoint temperature uniformity maps with an accuracy of ±0.2 oC are typically achievable in hot wall applications. Combined with SensArray's acquisition and analysis tools, the Process Probe 1535, with wafer sizes ranging from 50-300 mm, characterizes and fine-tunes process conditions in diffusion furnaces, fast thermal processors and other oxidizing gas environments.
Designed for collecting and analyzing thermal data critical to the manufacturing of semiconductor and LCD display processes, SensArray products help customers achieve the best possible reproducibility, process optimization and uptime associated with fabrication equipment. SensArray's products range from wafers instrumented with arrays of temperature sensors, to complete integrated measurement systems.
Process Probe 1535 is currently available in the United States, Europe and Asia.
SensArray Corporation, 47451 Fremont Blvd., Fremont, CA 94538. Tel: 510-360-5600; Fax: 510-360-5601.