Product/Service

SELA Navigation Software

Source: SELA USA, Inc.
SELA's new MC500 Navigation Software provides automatic navigation to a specific cleaving location for SEM and TEM sample preparation using defect coordinates and ID numbers from defect review and wafer inspection stations
SELA USA, Inc.emicon West

SELA's new MC500 Navigation Software provides automatic navigation to a specific cleaving location for SEM and TEM sample preparation using defect coordinates and ID numbers from defect review and wafer inspection stations.

Microcleaving is a dry, two-step scribe and cleave procedure that capitalizes on the cleaving characteristics inherent in single crystal semiconductor substrates and achieves sub-micron sectioning accuracy through the targeted feature. Producing high quality cross-sections quickly significantly reduces the diagnostic cycle for both failure analysis and process monitoring. Using cryo-cooling, precise cleaving at specific locations is possible even in layers of softer materials such as the newer low-k dielectrics and Cu. The MC500 Microcleaving System provides fully automatic, reliable, and speedy cross-sectioning of both integral die and wafer level samples.

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