Scanning Stepper
Canon U.S.A., Inc., Semiconductor Equipment Division, announced the introduction of its dual-era FPA-5000ES2 step-and-scan system. The new scanner has a very high (0.68) numerical aperture that covers both 0.25µ and 0.18µ design rules using 248nm KrF excimer laser illumination. As a dual-era machine, the FPA-5000ES2 scanner lets users apply their current DUV expertise to a new device generation. The ES2 scanner is dual era for wafer size as well, allowing a field upgrade from 200mm to 300mm with a simple wafer size conversion kit.
The FPA-5000ES2 scanner features enhanced vibration isolation structure; lightweight, very high speed reticle and wafer stages; and lens-tuning based on Zernike coefficient analysis. Its throughput exceeds 100 wafers (8 in.) per hour. Canon has built the FPA-5000ES2 scanner on a robust new platform it developed as the foundation for its new line of production-class step-and-scan 300mm exposure tools that will include 193nm ArF and I-line models, both featuring the same functionality as the ES2. Experience gained from introducing and installing the industry's first 300mm DUV stepper, the FPA-3000EX3L, contributed to the new Canon 5000 scanning system platform. EX3Ls are now in use by SELETE, I300I, and two of their member companies for the development of 300 mm processes and the evaluation of related equipment.
Many of the features of Canon's next-generation KrF scanning platform are the result of its continued advancements in vibration isolation, scanning speed enhancement and synchronization control, as well as exposure resolution performance. Another key design feature of the Canon 5000 scanning system platform is modularity, allowing more efficient configuration of in-line equipment and the illumination source. Canon formally introduced the FPA-5000ES2 scanner at Semicon West (Booth #5502), July 13-15 in San Francisco. It is taking orders for the new system now and has scheduled deliveries to begin in October 1998.
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