News | June 30, 2008

Rudolph Receives Follow-On Order From Micronas For NSX Macro Defect Inspection System

Flanders, NJ - Rudolph Technologies, Inc. recently announced the sale of an NSX Inspection System and Discover in-line defect analysis and data management software to Micronas, a supplier of integrated circuits (ICs) and sensor system solutions for consumer and automotive electronics. Rudolph's complete inspection solution—the NSX System with the Discover server and software—is scheduled for shipment in June 2008.

The NSX 115 joins an existing NSX 105 system in Micronas' Freiburg, Germany-based fab to provide additional inspection capacity demanded by the 100 percent inspection requirements of Micronas' customers in the automotive market. Rudolph's Discover software will link the systems to provide intelligent sampling strategies and fast, efficient identification of actionable events and trends. Martin Molan, General Manager of Rudolph's European business states, "Discover software has been particularly valuable for the automotive device makers, having demonstrated overall throughput enhancement of over 20 percent for the inspection and review step necessary to achieve zero defects."

"This purchase was driven by rapid growth in demand for our automotive products," commented Nikolaus-Viktor Kaeppeler, Vice President Operations at Micronas. "Our customers' requirements for 100 percent inspection made throughput our top purchase decision criteria. Our selection also reflects the excellent experience we have had with our first NSX system, and we believe the analysis and reporting features of Discover will help us understand and act on defect issues in a timely manner. High quality is a no-compromise area for our customers, as well as for us."

"The NSX 115 System with our Discover software is an industry-leading, complete solution for our customers," added Molan. "The combination of throughput and sensitivity has made the NSX the tool-of-choice for high-volume, zero defect inspection applications like automotive electronics.This market is dominated by European device manufacturers; over 90 percent of those manufacturers rely on Rudolph inspection systems to ensure their quality control."

Rudolph's Discover in-line defect analysis and data management system helps manufacturers use inspection data more effectively to reduce manufacturing costs and accelerate time to market for new products. Discover provides users with many useful features such as wafer display, customizable charts and fast incident alarms.

The NSX Macro Defect Inspection System is a fast, repeatable inspection solution designed for applications in the back end of the semiconductor manufacturing process. Macro defects (defects 0.5 micron and larger) can be created during wafer manufacturing, probing, bumping, dicing, or by general handling, and can have a major impact on the performance and quality of a microelectronic device. The NSX system quickly and accurately detects yield-inhibiting defects, ensuring product quality and providing valuable process information.

SOURCE: Rudolph Technologies