Reticle Inspection Tool
This high-throughput tool is designed to inspect the multi-die pelliclized reticles used for manufacturing application specific integrated circuits (ASICs) and high-volume integrated circuits (ICs).
The tool uses a beam-splitting technology to provide multi-beam UV reticle inspection capabilities, and incorporates an image computer that enables the use of Tera algorithms to provide high-sensitivity, die-to-die pattern inspection. It can conduct simultaneously transmitted and reflected (STAR) light inspection for contamination with concurrent die-to-die pattern inspection for detection of pattern defects on the chrome surface of reticles, improving the throughput of the tool by three- to six-fold compared to previous generation STARlight 300-Series tools. The tool detects defects on both the pellicle surface and backside of reticles in a single operation.
The tool can inspect a standard 6-inch reticle in less than one hour. For less critical layers on the reticle, it can provide inspection at better than 20 minutes per reticle.
<%=company%>, 160 Rio Robles, San Jose, CA 95134. Tel: 408-875-4200