Reticle Contamination Inspection System

This ultraviolet-based reticle contamination inspection system is designed to detect contaminants unique to deep ultraviolet (DUV) lithography. The Starlight SL3UV offers the sensitivity and minimum linewidth capability required to inspect the advanced reticles that are used to print integrated circuit (IC) patterns with 0.18, 0.15 and 0.13 micron geometries.

This system is designed to expand inspection capabilities on leading-edge reticles, which will drive ongoing development efforts in reticle process improvement and control. This product also enables reticle manufacturers to use smaller pixels for improved defect review. This system detects transmission defects and wavelength-dependent contaminants such as organic defects and gallium stains.

This system can inspect Tri-Tone phase shifting masks (PSMs), optical proximity correction (OPC) assist bars and surrounding chrome borders for defects and set different inspection sensitivities for different areas of the chip. It also enables higher scan rates for non-critical reticles and for reticle re-qualification, as well as more frequent sampling for improved detection of faulty reticles.

KLA-Tencor, 160 Rio Robles, San Jose, CA 95134. Tel: 408-875-4200. Fax: 408-434-4276.