Quadruple Mass Spectrometer In Situ Process Monitor System
The Orion CompactETCH quadruple mass spectrometer in situ process monitor system is designed for monitoring reactive ion etching, RF and high-density plasma etching, microwave etching, resist ashing, and etch chamber plasma clean
N/AompactETCH quadruple mass spectrometer in situ process monitor system is designed for monitoring reactive ion etching, RF and high-density plasma etching, microwave etching, resist ashing, and etch chamber plasma clean.
Three mass ranges are offered: 100 amu, 200 amu, and 300 amu. The system includes recipe-based Orion ProcessView software that can automate background gas analysis and the monitoring of multi-step processes.
The system for in situ process monitoring of plasma etch processes includes a closed ion source quadruple mass spectrometer, Unibloc inlet system, and integrated chemical-series turbomolecular pump. The Unibloc inlet valve allows sampling at both background pressure and process pressure.
The system can be installed on single-chamber tools as well as on cluster tools.
<%=company%>, 6 Shattuck Road, Andover, MA 01810, Tel: 978-975-2350, Fax: 978-975-0093