Process Control for Cu Interconnects

KLA-Tencorystem is a process module control solution for copper interconnects. It consists of defect-reduction tools, parametric control systems, and classification/analysis software. The system is designed to optimize the lithography, deposition, etch, and chemical mechanical planarization (CMP) process modules needed to create copper devices. Key components of the tool set include the company's integrated defect reduction and process parametric control systems, featuring defect classification software, advanced SEM review tools, and automated yield analysis systems; the eS20 in-line e-beam inspection tool for patterned wafers; and Sample Planner software, which devises e-beam and optical inspection strategies to achieve the most favorable trade-offs between the cost of inspection operations and the risks of yield loss due to undetected yield-limiting defects and process excursions.

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