Product/Service

PROBER FOR ULTRA-THIN OR DICED WAFERS

Source: Electroglas, Inc.
The 4090f Film-Frame Wafer Prober eases the identification of faulty semiconductor devices fabricated for advanced packages-including SmartCard, telecommunications and computing devices-- prior to their final assembly, thereby reducing manufacturing expense and improving production quality
Electroglas, Inc.ilm-Frame Wafer Prober eases the identification of faulty semiconductor devices fabricated for advanced packages-including SmartCard, telecommunications and computing devices-- prior to their final assembly, thereby reducing manufacturing expense and improving production quality.

The new Electroglas prober manipulates delicate wafers by means of adhesive, film-based frames that carry them from thinning operations, to probe, and through dicing. The prober accepts the film frames in cassettes, extracts and transfers them to the probe chuck with a special electromagnetic arm, secures them on the chuck by electromagnetic grippers, precisely steps them for probing, then returns them to the cassette, without injury to the die.

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