Pressure/Vacuum Compact Clean Oven: PCO-083TA

The PCO-083TA is clean oven that provides both pressure and vacuum treatments. A wide variety of heat-treatment processes under pressurization and depressurization conditions are made possible through this system. It can also provide low-oxygen curing for polyimide, material synthesis under pressure, and pressure-and-heat-treatment for the removal of bubbles in seal or adhesion resins.


  • Maximum operating temperature: 350oC (PCO-083TA), 400oC (PCO-083TAH)
  • Maximum operating pressure: 0.5 MPa
  • Ultimate vacuum pressure: 10 Pa
  • Adjustable increasing rates of temperature/pressure
  • Small footprint (less than 1m2)
  • Excellent temperature uniformity
  • Exchangeable stainless steel interior
  • Signal tower to indicate operation status

The PCO-083TA pressure/vacuum compact clean oven’s simple operation and easy set up makes it ideal for R&D applications. It’s best suited for the thermal treatment of semiconductor devices in their mounting process. For more information on the oven and its specifications, download the datasheet.