PowerDirect
Source: INCEP Technologies, Inc.
PowerDirect technology combines a high-performance coaxial interconnect with an optimal printed-circuit board layout pattern, to provide a cost-effective solution for power delivery directly to high-performance semiconductor devices.
PowerDirect technology combines a high-performance coaxial interconnect with an optimal printed-circuit board layout pattern, to provide a cost-effective solution for power delivery directly to high-performance semiconductor devices. The benefits associated with the PowerDirect include very low PCB surface and interplane area and improved PCB routability. Depending on the application, several PowerDirect components can be used to deliver electrical power from one substrate to another (intra-chip, chip-to-board, or board-to-board) resulting in the highest current per area compared to other traditional power delivery architectures.
There are several interconnect methods for the PowerDirect including plated-through-hole (PTH), screw, and surface mount technology (SMT). The various interfaces for the PowerDirect Coaxial Interconnect offer several assembly options and performance for PCB and chip designs.
INCEP Technologies, Inc., 10650 Treena Street, Suite 308, San Diego, CA 92131. Tel: 858--547-9925; Fax: 858-547-9926.