Post Fab Inspection Tools
Source: Electroglas, Inc.
QuickSilver is a line of automated inspection products designed to deliver a sort-floor cost breakthrough for semiconductor fabs
QuickSilver is a line of automated inspection products designed to deliver a sort-floor cost breakthrough for semiconductor fabs.
The tools employ the same time delay integration imaging technology as optical defect detection systems, but with resolution consistent with the needs of sort-floor inspection.
Utilizing an open architecture, the product serves as a data acquisition tool providing information for higher level process management and yield analysis systems based on industry-standard data formats.
There are four models in the product line:
- QS-100 Microstructure Inspection provides measurement of critical dimensions on devices and IC pacakges including print heads, packages, MEMS, and other custom applications.
- QS-200 Defect Inspection supports automatic inspection of wafers for defects at probe, final inspection and other operations with detection and classification down to 0.5 µm and feature measurement to 0.25µm precision.
- QS-300 Bump Defect Metrology 2D measures bump diameter and placement, and inspects for wafer defects. Precision to 0.25µ is supported as well as defect detection and classification.
- QS-330 Bump Defect Metrology 3D offers measurement of bump dimensions and defects following bump reflow processing. This includes volume, planarity, diameter and placement.
Electroglas, Inc., 2901 Coronado Dr., Santa Clara, CA 95054. Tel: 408-727-6500; Fax: 408-982-8055.