POST-CMP CLEAN TOOL

DamasClean™ is STEAG MicroTech's single-wafer-clean division's new cleaning tool. DamasClean is designed for 200 mm cleaning applications and addresses chipmakers' needs for superior process performance, reliability and high throughput for single-wafer clean processes.

Available as a stand-alone tool, the DamasClean platform can also be integrated into a cluster tool as an OEM product. The DamasClean features multiple cleaning mechanisms, a modular architecture, an industrial-standard robot-platform, a flexible process-flow and single wafer drying through STEAG's latest Lineagoni technology. In the stand-alone version, the DamasClean is the industry's first post-CMP cleaning tool that allows users the choice of a two-step serial or a one-step parallel cleaning capability. When coupled with modular cleaning mechanisms and the dual-cassette input/output station, these features open a wide range of applications.

With STEAG's DamasClean, wafers are processed in a horizontal orientation to allow independent topside and backside treatment of wafers and accelerated wafer handling. The DamasClean tool comes equipped with two cleaning stations and two Lineagoni drying stations. The two cleaning stations can be equipped with interchangeable brush modules or a unique Jet Stream™/Megasonic cleaning modules. Therefore, the DamasClean can be used for brush cleaning as well as for brushless cleaning applications.

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