Product/Service

Positive Tone Photodefinable Polyimide

Source: HD MicroSystems L.L.C.
The HD-8000 photodefinable polyimide developed for single mask, stress buffer passivation applications on DRAMs, SRAMs, logic devices and microprocessors
HD MicroSystems L.L.C. photodefinable polyimide developed for single mask, stress buffer passivation applications on DRAMs, SRAMs, logic devices and microprocessors. The high resolution polyimide is positive tone and processes with common aqueous, positive resist developers.

HD MicroSystems L.L.C. allows semiconductor fab manufacturers to implement a new polyimide stress buffer procedure or convert an existing wet-etch polyimide process over to a photodefinable polyimide without changing existing reticles or developer tracks.

HD-8000 is ideal for use as a silicon nitride etch dry mask for all IC applications. It has an aspect ratio of 2 to 1 and is capable of imaging four micron features in eight micron cured films.

To assure good wafer coating uniformity and keep the backside of the wafer clean, HD-8000 will be offered with an NMP-free, edge bead remover (EBR), PA-800E.

Based on a true aromatic polyimide backbone, HD-8000 offers thermal stability and mechanical integrity. Compared to conventional polyimides, it has a fast cure cycle of 90 minutes for improved throughput. The new product has a Tg (glass transition temperature) of 300 °C and a cured film thickness range of 5 to 10 microns. The polyimide can be imaged with I-line or G-line steppers or broadband phototools.

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