Polishing Pad

The SPM3100 polishing pad was developed for use in the final polish step of silicon wafers and alternative substrates, such as gallium arsenide (GaAs) and indium phosphide (InP).

The pad is an advanced poromeric pad that offers repeatable physical properties by design. Property variation is a common problem for poromeric pads coated on felt substrates, the traditional type of pad used in final polishing applications. The pad's proprietary pore structure, which is grown directly on Mylar to reduce physical property variation, was optimized in Rodel's Material Development Center. The pore structure provides the necessary balance between pad compressibility and hardness, providing low nano-scratch levels, light point defects (LPD's) and haze while maintaining the wafer's geometry. The optimized pore structure and repeatable physical properties ensure consistent performance from the first run after installation.