Product/Service

Plastic Ball-Grid Array

Source: ChipPAC Inc.
This enhanced plastic ball-grid array (EPBGA) is designed to provide electrical performance in complex designs, including systems on chips and application-specific integrated circuits (ASICs)

This enhanced plastic ball-grid array (EPBGA) is designed to provide electrical performance in complex designs, including systems on chips and application-specific integrated circuits (ASICs). The EPBGA is a fine-pitch wire-bonded package that utilizes a 4-layer substrate with power and ground planes for thermal and electrical performance. The packages are available in 300 to 800 pin counts and package sizes of 35mm to 45mm. Staggered bond pads of 45um to 90um are available on this product. These specifications allow it to deliver high performance and accommodate high frequency levels for devices with medium to high I/O counts.

Suitable applications for include ASICs, programmable logic devices (PLDs), digital signal processors, and graphics controller chips. Target market applications include routers and switches in networking and workstations and servers in the high-end computing arenas.

ChipPAC, 3151 Coronado Drive, Santa Clara, CA 95054. Tel: 408-486-5900. Fax: 408-486-5910.