Plasma System 300 Semi-Auto
Source: Tepla Inc.
High throughput, damage-free Resist Stripping
High throughput, damage-free Resist Stripping
- Damage-free
- Lowest COO
- Minimum Footprint
- Primary Plasma For High Ash Rates
- Fast, Reliable
- Simple, Easy to Install
- Very High Productivity
- Removal of photresist after implant or dry etching Wafer and sustrate cleaning
- Suitable for various substrate technologies, like silicon, III/V-compounds, quartz, ceramic, lithium niobate etc.
- SOG curing (densification)
- Compatible with copper technology
- Qualified for 0.18µ technology
Tepla Inc. , 1321 Valwood Parkway, Suite 400, Carrollton, TX 75006. Tel: 972-247-0053; Fax: 972-247-0405.