Plasma System 300 Autoload PC
Source: Tepla Inc.
High Capacity Damage-free Resist Stripping and Wafer Cleaning
High Capacity Damage-free Resist Stripping and Wafer Cleaning
- Easy Resist Removal following High Dose Implant or
- Dry Etching
- 200 mm Wafer Capability
- Guaranteed very Low Particle Level
- Dramatically reduced Cost-of-Ownership
- Minimum Footprint
- Cassette Load Option
Primary Microwave Plasma provides:
- Primary Plasma for High Ash Rate
- Microwave Energy for Highest Chemical Efficiency
- Guaranteed Damage-free Processing with very Low Plasma Potential
- Non-Critical Overash and Safe Removal of Overlaid Resist Films
Batch Processing Provides:
- High Productivity
- Reliability of Simple and Easy
- Controllable Technology
- Slow Temperature Ramp-up to avoid Resist Popping
- Enhanced Desoprtion of Residues
- SOG Curing Capability
Tepla Inc. , 1321 Valwood Parkway, Suite 400, Carrollton, TX 75006. Tel: 972-247-0053; Fax: 972-247-0405.