Product/Service

Plasma Etch System

Source: Applied Materials, Inc.
The Dielectric Etch Super e Centura extends the company's magnetically-enhanced reactive ion etch (MERIE) line
Applied Materials, Inc.ric Etch Super e Centura extends the company's magnetically-enhanced reactive ion etch (MERIE) line. Well suited for etching advanced via structures and sub-0.18 micron dielectric etch applications, the system offers a 30 percent reduction in cost of ownership and up to 50 percent improvement in throughput over previous systems. Offering throughputs of up to 110 wafers per hour, the system also features critical dimension (CD) uniformity through its ceramic electrostatic chuck which achieves better than +/- 10-nm bias variation for 0.18 micron devices.

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