Trikon Technologies' Sigma PVD (physical vapor deposition) system is suitable for applications such as general multi-level stack metalization, titanium/titanium nitride (Ti/TiN) barrier/liner, and deep sub-micron, high-aspect ratio interconnect contact and via structures.
Design changes including two additional module ports, an in-line cool-down station between cassette and transfer area, faster dual and effector arm, and module enhancements provide throughput sixty percent higher than earlier versions of the platform. The system's shielding design and hoist mechanism reduce cleaning time and downtime.
The company's manufacturing systems are used for three of the four major processing steps in the manufacture of a semiconductor device: etch, physical vapor deposition and chemical vapor deposition (CVD).
Trikon Technologies, Inc., 9255 Deering Avenue, Chatsworth, CA 91311-5804. Tel: 818-886-8000; Fax: 818-886-2245.