Physical Vapor Deposition Platform
Source: Applied Materials, Inc.
The Endura SL is a new generation of its industry-leading Endura PVD (physical vapor deposition) platform
Applied Materials, Inc.SL is a new generation of its industry-leading Endura PVD (physical vapor deposition) platform. The new platform features high throughput and productivity in several PVD applications and expands Applied Materials, Inc.family of products to provide customers with a complete offering of PVD solutions.
The system, which is available with several PVD aluminum and barrier layer process chambers, is the industry's only system to use two dual-blade robots for faster wafer handling and higher transfer speeds. The system's new loadlock module accommodates the degas and cooldown chambers, enabling up to six process chamber positions on the platform for maximum system capacity and overall throughput. Applied Materials, Inc.SL is smaller than Applied Materials, Inc.PVD system, conserving costly fab floorspace.
The system, which is available with several PVD aluminum and barrier layer process chambers, is the industry's only system to use two dual-blade robots for faster wafer handling and higher transfer speeds. The system's new loadlock module accommodates the degas and cooldown chambers, enabling up to six process chamber positions on the platform for maximum system capacity and overall throughput. Applied Materials, Inc.SL is smaller than Applied Materials, Inc.PVD system, conserving costly fab floorspace.
<%=company%>, 3050 Bowers Ave., Santa Clara, California 95054. Tel: 408-727-5555; Fax: 408-986-8352