Product/Service

Phantom II

Source: Trion Technology
Table Top Reactive Ion Etch System Upgradeable to a Vacuum Load-Lock
Table Top Reactive Ion Etch System Upgradeable to a Vacuum Load-Lock

The Phantom II is Trion's most advanced process platform. It is the base platform for our Inductively Coupled Plasma (IPC) source. With it's user friendly process controls, close coupled turbo pump, ICP and optional electrostatic chuck it can be used to accomplish the most challenging etch processes.

The system has been designed to meet all safety and etching requirements in the laboratory environment. Its modular design and optional gas cabinet provide the engineer with a turnkey system that meets all safety, facility and processing needs.

Numerous options can be incorporated into the system or as field upgrades. Load-lock, robotics, turbo-pumps, end point systems, gas cabinets and various plasma sources are available.

Applications
Processes have been thoroughly developed for anisotropic etching of silicon dioxide, silicon nitride, and other materials requiring high selectivity and a controlled anisotropic etch. Our demonstration lab is available for new materials.

System specifications: 35"Wx26"Dx48"H
RF Power: 600 watt, 13.56 MHz
Up to 6 Mass Flow Controllers
Maximum wafer size: up to 8"

Trion Technology, 1025 South 52nd Street, Tempe, AZ 85281. Tel: 480-968-8818; Fax: 480-968-5596.