onQ Technology Now Tapes 4x4 MLP and MLF Packages

onQ Technology's services now include tape and reel packaging for new packages such as 4 x 4 MLPs and MLFs. Processing can be done from tray-to-tape or tray-to-tray with full 2D and 3D lead scan and inspection done on all parts. Inspection capabilities also include gull wing, J-lead, BGA, and CSP packages, parallel inspection of lead/ball, mark, and both top and bottom inspection.

onQ Technology engineers can analyze the components and help determine the appropriate packaging specifications required for ample part protection. The system provides many levels of reporting, including concise and complete summaries of the entire taping and inspection process. SPC tools enable batch mapping and job level statistics to monitor production and compare runs. Due to the high throughput of onQ Technology's tape and reel machines, onQ can handle the high volume, quick turnaround needs of almost any company.

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