Multi-Head Dispensing Technology

The XYFLEX design provides accuracy, throughput, and flexibility. Four independently programmable heads with up to eight pumps dispense encapsulants or flip chip underfill to meet the most stringent process parameters for semiconductor packaging. Throughout up to 1,000 units per hour may be achieved (350 mg, dam-and-fill application).

The XYFLEX was developed based on the recommendations of CAM/LOT's core customers. CE and SEMI S2 compliant, XYFLEX features a multi-segmented, dual-line conveyor system (optional). Heated vacuum chucks accommodate Auer boats or film strips. Lacking an X-axis drive train, the positioning of the dispensing heads is accomplished by guide arms attached to the Y-axis ball screws at one end and a pivot point on the pump head at the other end. Movement of the ball slides in opposite directions along the Y-axis causes movement along the X-axis. Precision positioning is achieved with linear rotary encoders and closed-loop servomotors.

XYFLEX is also available for SMT applications, capable of dispensing solder paste and adhesives at speeds of up to 140,000 DPH. Additional features include a vision alignment system, auto needle calibrator, and Windows NT operating software. A newly designed computer platform, incorporating a flip-up keyboard and tilting LCD panel, moves across the length of the system for ease of operator.

Speedline, 145 Ward Hill Ave., Haverhill, MA 01835. Tel: 978-373-3742; Fax: 978-521-2105.