Multi-Flip-Chip Bonder

Featured at Semicon Europa

The multi-flip-chip bonder can process wafers up to 8 in. The ICs are picked off the wafer by a one or multi-needle ejection system. A flip-chip unit turns the chips 180º (die-flip). A pick and place tool then picks up the ICs. At almost the same time, the components are placed on the substrate. The speed inclusive of the die-flip movement is about 1.4 s per IC with a placement accuracy of <10^µm. Chip sizes of 0.2mm to 20mm edge length can be processed. Optimal prerequisites are thus created for use of the PPS 2200 as a flip-chip bonder offering the option of picking up ICs directly from the wafer.

The use of waffle packs or gel packs is also provided for up to 4 in by 4 in. Also possible is the processing of SMD components from a number of conventional feeder systems. The use of Datacon PPS 2200 as a die-sorter with flip function is also possible so that various ICs can be removed from wafers and placed in waffle packs.

Datacon. Innstrasse 16, A-6240 Radfeld/Tirol. Germany. Tel: +43-5337-64 8 34, Fax: +43-5337-64 8 34-9.