Multi-Die Packages
Source: ChipPAC Inc.
M2CSP is a wire-bonded molded multi-die chip-scale package that reduces the mounting space on printed circuit boards
M2CSP is a wire-bonded molded multi-die chip-scale package that reduces the mounting space on printed circuit boards. These packages require only 154mm2 mounting area.
Side-by-side mounting of two devices in a single package provides customers with a space-saving option for portable applications. The package is available in four options, including combination memory/memory, memory/logic, logic/logic, or logic/analog.
ChipPAC Inc., 3151 Coronado Drive, Santa Clara, CA 95054. Phone: (408)486-5900. Fax: (408)486-5910
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