MRC Introduces PVD Sputtering System at SEMICON/Japan '97

Materials Research Corporation (MRC) announced its latest physical vapor deposition (PVD) sputtering system in Tokyo yesterday at SEMICON/Japan '97. The Eclipse Mark IV, specifically designed for front or backside production metallization of semiconductor wafers, offers solutions for 200mm wafer configurations at 0.25 um and below.

According to Mike Lombardi, MRC senior product manager for the Eclipse Mark IV, the PVD system "performs fast, clean, uniform advanced metal coating, including long throw, collimation, and ionized PVD (iPVD) directional coating, of small device features with high aspect ratios."

The Eclipse Mark IV is an ultra high vacuum (UHV), serial indexing, vertical PVD sputtering system with an advanced digital control system, user friendly software, and chamber geometries for 200mm wafers. The system has a flexible platform that can be custom configured for a wide variety of metal applications including interconnects (Ti/T/TiN and Hot Al for via fill); barriers (TiN and TiON, TiW, and TiWN); silicides (Ti, Co, Pt); conductors (Ta, TaN, Ta/Au, TaAl); and packaging and GaAs (Ni, NiV, Cr, Cu, Au, Ag).

MRC, based in Gilbert, Ariz., supplies processing equipment and high-purity materials for the semiconductor and thin-film industries.