Modular Equipment

Technic Inc., SemiConductor Divisionlar equipment is designed for processing semiconductor products and is engineered to meet the manufacturing standards of SEMI S2-93. This family of tools is designed for plating applications including: copper, nickel and gold metallization or tin-lead wafer bumping. Custom designs are available for other wet bench applications including: requirements for electroless under bump metallization, copper, nickel and gold on flat panel display, high density interconnect laminates and ceramic substrates, as well as other wet processes for develop, strip and etch.

Features include:

Modular construction – Manufactured in standard 48 or 60 inch modular sections

Flexible process cell design – Removable cell components may be reconfigured for different sized products

Controlled flow pumping – Eliminates temperature stratification and pump cavitation

SEMI S2-93 and factory mutual fire standard compliant – Assures safety, certification available on request

<%=company%>, 1170 Hawk Circle, Anaheim, CA 92807. Tel: 714-632-0200. Fax: 714-632-1056.