Model Automated Production Applications (MAPA) APC Software

Yield Dynamicsutomated Production Applications (MAPA) APC Software gathers data automatically from multiple metrology sources. Raw, modeled and simulation data are stored in a relational database. Data is automatically analyzed using common statistical process control (SPC) techniques as well as statistics derived from tool and process models and subsequent simulations tied to the derived model structures. Systematic and random error modeling for overlay and registration information is provided.

The APC software and its engineering modules address calibration, modeling and simulation of stepper and scanner lens wavefront analysis, focus uniformity and critical dimension (CD) performance.

Typically, production data under-samples ("sparse sampling") the amount of data needed to properly characterize the performance of wafer fab lots. Using tool and layer-dependant models and simulations, MAPA extends sparse sample production data to adequately describe lot distributions. Models provide a base estimate for the systematic and random components of the errors. The components are then simulated into field, wafer and lot-projected array distributions to obtain production performance statistics that are more accurate than any previously available.

The accuracy of the technique results in lower rework rates and higher capacity utilization and improves WIP by removing the need to use dedicated exposure tools.

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