Product/Service

Model 3500-II Automatic Component Assembly Cell

Source: Palomar Technologies
The Model 3500-II is designed for fully automatic, high speed, precision microelectronics assembly. The flexible, computer controlled workcell performs adhesive dispense, component placement and flip chip operations over a
  • Flip chip
  • Chip-on-board
  • Fine pitch SMT
  • Multichip modules
  • Microwave modules
  • Hybrid microcircuits

    The Model 3500-II is designed for fully automatic, high speed, precision microelectronics assembly. The flexible, computer controlled workcell performs adhesive dispense, component placement and flip chip operations over a spacious 700 sq.in. work area. The machine base, a honeycomb core optical table, provides vibration damping and thermal settling response superior to granite.

    Submicron axis resolution yields typical placement accuracies of ±0.5 mil (12.7 µm). The cantilever design permits unobstructed, open access on three sides for setup, and an infrared light curtain ensures operator safety during production. Soft touchdown, or non-contact laser height sensing mechanisms assist in precise pickup and placement of fragile devices such as GaAs. An 8-position, bi-directional turret head can rapidly change tools on the fly without a space-consuming tool dock.

    An advanced Cognex gray-scale pattern recognition system locates randomly oriented device features under a wide variety of background conditions and lighting. The PR system includes auto focus and programmable magnification and light intensity.

    Operating in a true Microsoft® Windows™-based environment, the Model 3500-ll brings unparalleled software versatility, power and ease of use to microelectronics assembly. The graphical, user-friendly interface assists in bonding setup, operation, diagnostics, and calibration.

    Model 3500-ll options include equipment for fully automatic substrate handling: input, preheat, eutectic heating stage, cool down and transfer. Many other options are available to meet special application requirements for custom cells and in-line systems:

  • Automatic dispense in series with pick/place
  • Waffle pak, gel pak, and tape and reel presentation
  • Single, quad, and six-up wafer die ejectors
  • Automatic eutectic die attach assembly
  • Start-to-finish in-line component assembly

    Innovative Solutions for:

  • Volume Production
  • Reduction of Setup Costs
    Rapid Prototyping/Quick Turn Projects

    Palomar Technologies, 2230 Oak Ridge Way, Vista, CA 92083-8341. Tel: 760-931-3600; Fax: 760-931-5191.