Product/Service

Model 2460-V Automatic Wire Bonder

Source: Palomar Technologies
High-speed, Precision Ball and Stitch Bonding
  • High pin count devices
  • Complex multichip modules
  • Fine-pitch hybrid microcircuits
  • Ceramic circuit boards
  • Chip-on-board
  • Chip-on-flex

    CE compliant with feature-rich, productivity enhancing software designed for highperformance, first-level, gold wire interconnect assembly applications, the Model 2460-V continues the tradition of field-proven dependability with exceptional performance and reliability for fine-pitch interconnect applications.

    Proven Quality and Reliability
    The Model 2470-V is built on a proven platform, backed by years of rigorous production use in demanding applications worldwide. Our family of interconnection products coupled with extensive applications experience brings solutions to your challenging production requirements.

    Customer service assistance in evaluating proposed applications is available. Optional service contracts are available for extended labor warranty, preventive maintenance calls, or software updates. The full coverage service contract provides comprehensive, priority service.

    Palomar Technologies, 2230 Oak Ridge Way, Vista, CA 92083-8341. Tel: 760-931-3600; Fax: 760-931-5191.