Minilock II

Reactive Ion Etch System with a Vacuum Load-Lock

The Minilock II is the first system in our industry which incorporates a vacuum load-lock in a compact table top console. The system has been designed to meet all the safety and equipment needs for the more challenging processes in the laboratory environment. Its modular design and optional gas cabinet provide the user with a turnkey system that meets your safety, facility and processing needs.
Today's advanced processes require a vacuum load-lock for three reasons:

• Process Reproducibility:

Metal etch processes are usually moisture sensitive; therefore to obtain a reproducible process, the reactor must be isolated from atmospheric moisture.

Operator Safety: Metal etch processes usually require chlorinated chemistries. Due to the fact that chlorine is corrosive in nature, the reactor must be load-locked to protect the operator.

Vacuum Integrity: When operating in the lower RIE pressure ranges it is difficult to maintain a reproducible vacuum in a chamber where the main seals are broken every run and the chamber is exposed to the atmosphere repeatedly.

Applications
Anisotropic etching of aluminum, silicides, gallium arsenide and other materials requiring chlorinated chemistries.

Anisotropic etching of silicon dioxide, silicon nitride and other materials requiring high selectivity and a controlled anisotropic etch.

System specifications: 35"Wx26"Dx48"H
RF Power: 600 watt, 13.56 MHz
Up to 6 Mass Flow Controllers
Maximum wafer size: up to 8"

Trion Technology, 1025 South 52nd Street, Tempe, AZ 85281. Tel: 480-968-8818; Fax: 480-968-5596.