Metrology and Inspection Tools for Wafer Processing

Schlumberger Semiconductor Solutionserger IVS 135 is an advanced metrology tool for 0.13-micron design rules. Advances in process technology have created buried, low contrast CMP layers that until now were not measurable within the required tolerances of sub 0.2-micron processes.

Schlumberger has also introduced productivity-enhancing metrology software tools including Adaptive RG to guarantee measurement success on CMP and STI processes, and Remote Job Generator for off-line programming capabilities that can drastically reduce WIP hold times.

Shown publicly for the first time in North America, Schlumberger Semiconductor Solutionserger Odyssey is the next generation wafer inspection system for <0.1-micron processing. The Odyssey 300 detects sub-surface defects with the highest sensitivity and effective speed. Odyssey's large Field of View (FOV) lens sees more area, allowing slower stage speed and reduced stage noise. VCDD, Schlumberger Semiconductor Solutionserger voltage contrast biasing capability, uncovers buried electrical defects that can't be seen by any other means. Because Odyssey provides results in real-time, users do not need to wait for review station analysis.

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