Metal Deposition Systems - UNITY-EP CVD
Source: Tokyo Electron America, Inc.
TEL entered the Metal Chemical Vapor Deposition market in 1994 with one system. In just 5 years, TEL has grown to the second largest metal CVD supplier with over 35% of the world wide market, by introducing the UNITY-EP CVD and MB2-730 metal deposition systems...
TEL entered the Metal Chemical Vapor Deposition market in 1994 with one system. In just 5 years, TEL has grown to the second largest metal CVD supplier with over 35% of the world wide market, by introducing the UNITY-EP CVD and MB2-730 metal deposition systems. TEL provides solutions to your most advanced CVD tungsten, tungsten silicide, titanium, titanium nitride, and tantalum oxide process requirements for DRAM and Logic applications. The processes are predominately LPCVD and require an in-situ chamber clean. The TEL chamber clean technology effectively cleans the entire chamber and eliminates consumables and erosion of chamber parts due to cleaning.
The UNITY-EP CVD supports four process modules including a pre-deposition clean module with additional ports for Degas and Cooling. The UNITY-EP CVD system was designed to deliver productivity enhancements on processes for CVD metal and metal oxide films, enabling high volume manufacturing of state-of-the-art integrated circuits.
Tokyo Electron America, Inc., 2400 Grove Blvd., Austin, TX 78741. Tel: 512-424-1000; Fax: 512-424-1034.