Product/Service

Metal Deposition System

Source: STEAG Electronic Systems
Steag-CuTek has developed a metal deposition system and cluster tool, ElectroDep 2000 which includes metal deposition along with other process modules to meet current as well as future requirements
STEAG Electronic SystemsEMICON West 2000

Steag-CuTek has developed a metal deposition system and cluster tool, ElectroDep 2000 which includes metal deposition along with other process modules to meet current as well as future requirements.

The ElectroDep 2000 has been designed as a versatile wet metal deposition system. It can be utilized for deposition of several different materials (Au, Cu, Pt) with only a change of electrolyte. Additionally the system can be used in a single unit operation mode or as a serial cluster tool.

Key core technology for the plating module includes standard implementation for an insoluble anode, combination of plating and rinse/dry in a single module, face up wafer processing, and sealed contacts.

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