Product/Service

MCM Assembly System

Source: Die-Tech, Inc.
Die-Tech's MCM Assembly System performs state-of-the-art package assembly and lead attach on MCM-C quad packages
Die-Tech's MCM Assembly System performs state-of-the-art package assembly and lead attach on MCM-C quad packages and other popular types of multi-chip modules.

This semi-automatic assembly line features Die-Tech's unique Solder-Laden Leadframe process, which enables the attachment of fine pitch leads with solder already in place to substrates, quickly and economically. The MCM line is comprised of Die-Tech's Model 2991 SIP/SMD Lead Attach Machine, which attaches fine pitch, solder-laden leadframes to each side of a substrate to produce a leaded quad package. The Model 2500 Flux Applicator then ensures fast and efficient deposition of flux onto the leaded, fine pitch quad packages.

Once the quad packages have had the leads attached and been soldered and cleaned, they are loaded into the third machine in the MCM system, Die-Tech's Model 2916 Trim and Form unit. This machine produces a precision-formed gull-wing package with carrier strips removed.

Die-Tech, Inc., 295 Sipe Road, York Haven, PA 17370. Tel: 717-938-6771; Fax: 717-938-6099.