Low k Black Diamond CVD Dielectric Film

The low k Black Diamond CVD dielectric film is a production-worthy film for blanket applications that is easily integrated with existing process technologies to provide customers with a low risk, low cost solution to their emerging dual damascene copper/low k interconnect designs. Black Diamond will be introduced as a family of low k dielectric films that are expected to extend to a dielectric constant of k less than/equals to 2.4.

The first product, named BD27, with a dielectric constant of 2.7, was designed for 0.18µ technology. BD27 will be available initially on the company's Centura platform in a configuration with up to four process chambers and later on the company's new Producer platform, including future versions of the systems for 300mm wafers. All Black Diamond-series films will be based on the company's DLK chamber hardware to provide multi-generation low k capability.

Black Diamond technology is available for customer demonstration at the company's Equipment and Process Integration Center (EPIC), which is the semiconductor equipment industry's first facility with a complete set of equipment and technologies for copper/low k interconnect technology integration.

Within EPIC, customers can use the company's extensive process knowledge in all of the interconnect fabrication technologies to develop and evaluate a complete copper damascene process flow, as well as receive critical electrical performance data. EPIC's capabilities allow customers to quickly integrate Black Diamond with the prior chemical mechanical polishing step, as well as the subsequent dielectric etch and ashing steps in a fully characterized process flow.

Applied Materials, Inc., 3050 Bowers Ave., Santa Clara, CA 95054-3299. Tel: 408-727-5555; Fax: 408-748-9943.