Lithography Stepper for the Flip-Chip Market

Ultratech Stepper Inc.aturn Spectrum 3e Lithography Stepper incorporates features that improve tool productivity and ease-of-use, making it a suitable lithography solution for high-volume flip-chip (bump) and wafer-level packaging manufacturing.

The stepper features an improved machine vision system (MVS), with the addition of the PatMAX architecture. This pattern recognition based alignment system eliminates the need for dedicated targets and simplifies integration with existing processes-a critical element for automating bump processing. The Saturn Spectrum 3e also features improved illumination, providing an increased wafer plane irradiance of 1900 mW/cm2, resulting in decreased exposure times, which improves productivity. In addition, the tool incorporates an automated field aperture changer to enable faster reticle field size changes, as well as an automated broadband ghi-line filter changer, allowing automated switching between either g, h or i-line exposure capabilities.

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