Known Good Die Test/Handling Solution

The MP650 is capable of combining automatic Bare Die handling with multiple levels of vision inspection and up to five test stations for sequential, parallel, or combined testing. The MP650 accepts standard frame-mounted wafers or individual die in waffle pack trays with output to tape, waffle pack trays, bulk bins, or reconstructed wafer with 100% known good die.

The die are selected automatically via vision (ink jet rejection) or by wafer mapping and then rotated into position and placed into a flipper nest. The flipper nest has the ability to flip the die 180° for inspection or testing of the bottom side of the die. The die is then inserted into a test nest where it is contacted by conventional wafer probes.

The design of the test nest provides a single contact to the die for multiple tests, thereby reducing the number of touchdown scrub marks and other possible physical risks. Rejected die can be binned according to the failure mode of to a Q/A pack for reinspection. Throughput for the MP650 is 2,200 units per hour.

Isméca USA, Inc., 2440 Impala Dr., Carlsbad, CA 92008, Tel: 760-931-1153; Fax: 760-931-8713.