Jordan Valley Semiconductors Introduces X-ray Based Thin Film Metrology Platform

Austin, TX -- Jordan Valley Semiconductors, Inc. has announced the release of its JVX 6200 metrology tool platform. The new platform combines X-ray Reflectivity (XRR), micro-spot X-ray Fluorescence (XRF), and Small Angle X-ray Scattering (SAXS). The new 6200 platform will deliver technological and business advantages to semiconductor manufacturers, according to Sean Jameson, Jordan Valley Vice President of Sales and Marketing.

"The 6200 extends Jordan Valley's lead in x-ray based film measurement systems suitable for high volume production fabs," says Jameson. "The SAXS channel has the capability to measure the pore size and distribution in porous low-k films. The data has shown excellent correlation to PALS and minimum pore size detection down to sub-10Å diameter pores. Additionally, the system's improved speed, reliability and extendibility significantly reduce cost of ownership, which is of paramount importance in the industry today," he adds.

The new Jordan Valley metrology platform features a smaller maintenance footprint, reduced preventative maintenance, higher throughput on XRR brightness and XRF flux, and new algorithm sophistication with a dual-processor CPU which enables true real-time processing.

The 6200 platform's technological innovations also include smaller spot size XRR and XRF, enhanced performance on high scatter samples and ultra-thin films (<30 Å), extended thickness range XRR measurements, and "smart" algorithms. Additional system benefits are increased stage stepping resolution and stage performance on bowed wafers, improved pattern recognition with edge models and increased low-contrast feature performance, a color camera and microscope with enhanced magnification, and a new WindowsXP operating system.

SOURCE: Jordan Valley Semiconductors, Ltd.