ITI-2000 Singulating Saw System For BGA and CSP Semiconductor Packages
This new system was designed specifically for singulating (dicing) semiconductor packages such as BGA (Ball Grid Arrays), CSP (Chip Scale Packages), chip carriers, and other packages. It features very high throughput, a high-speed vision alignment system, rapid part changeover, and a small footprint.
Until now, process engineers have had to adapt silicon wafer saws or hard material saws for singulation. Those systems do not provide the throughput required, are difficult to implement product changeovers, and are expensive to maintain.
"Process engineers are now able to benefit from ITI's 40 years of experience building precision saw machines and consumables. With the ITI-2000, it is now possible to have all the benefits of a saw specifically designed for the application," said Donald Murphy, President and CEO, Industrial Tools, Inc. "The days of forcing the wrong equipment to do the job are over. The ITI-2000 can be quickly configured for new parts, has high-speed alignment features, and can align to each individual street to account for part to part variations."
Industrial Tools Inc., 1111 S. Rose Avenue, Oxnard, CA 93033. Tel: 805-483-1111; Fax: 805-483-6302.