Integrated Thickness Monitoring (ITM) System

Featured at Semicon West

Nova Measuring Instruments Ltd. is introduces its 300mm Integrated Thickness Monitoring (ITM) system, the Imetra-P. The Imetra-P is based on the NovaScan 210/420 ITM systems used for on-line thickness uniformity measurements on stationary product wafers in CMP and other related processes. The system incorporates patented optical scanning and real-time dynamic auto-focus, as well as unique pattern recognition for arbitrarily oriented wafers and proprietary algorithms for in-water simultaneous double layer measurements. Installed directly on CMP equipment and measuring each processed water immediately after polishing, ITM systems increase the polisher effective throughput from 30%-70%. Nova is working with all polisher manufacturers to fully integrate the Imetra-P system into the 300 mm polishers.

The system measures 12-in. wafers with no loss in performance and offers a cost-effective upgrade path for fabs moving to 300mm manufacturing. The system enhances cost-effective pilot line process development and qualification and supports both patterned and blanket wafer measurements before and after polishing. Improvements to the 200mm systems include life color imaging, a wider spectral range, and higher scanning speed. The system has a built-in patented wafer handler for bubble-free in-water loading with no front side contact. Nova develops, manufactures, and markets integrated thickness monitoring (ITM) systems that perform on-line automatic monitoring of deposition, etching, and Chemical Mechanical Polishing (CMP) processes. The company has pioneered a new approach for real-time metrology and mapping of product wafers for enhanced process control. Its products are installed in the USA, Japan, the Far East, and Europe.

Nova Measuring Instruments, Weizmann Science Park, P.O. Box 266, Rehovoth 76100, Israel Contact: Ronen Frish, 972-8-938-7505; Fax: 972-940-7776.